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DX-LR30 900M22SP Development Kit SX1262 Chip LoRa Module RF Module 868-915MHz 8km 22dBm UART Long Range LoRa
Brand ISTOVO
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Delivery: Standard (Free) | Thu 10th - Tue 15th Sep
Returns: 30 days
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Description & Details
Summary
- Long-Range Connectivity: Equipped with the SX1262 LoRa technology, this wireless module offers an impressive range of up to 8 kilometers, ensuring reliable communication over vast distances.
- Versatile Frequency Support: Supports multiple frequencies 850-930Mhz, including 868Mhz and 915Mhz, making it highly adaptable for global use in various applications.
- High Power Output: With a power output of 22dBm, this module provides robust signal strength that penetrates through obstacles, enhancing connectivity in challenging environments.
- Compact Design: The small form factor and surface-mount design make it easy to integrate into a wide range of devices, from industrial equipment to consumer electronics, without compromising on performance.
- Specification: Chip Model: SX1262, Module Dimensions: 20x14x2.3mm, Communication Protocol: LoRa Protocol, Transmit Power: 0~+22dBm, RF Interface: Stamp Hole/PEX, Hardware Interface: SPI, Modulation Method: LoRa and GFSK, Operating Voltage: 1.8V-3.7V.
DX-LR30 900M22SP Development Kit SX1262 Chip LoRa Module RF Module 868-915MHz 8km 22dBm UART Long Range LoRa Description
Long-Range Connectivity: Equipped with the SX1262 LoRa technology, this wireless module offers an impressive range of to 8 kilometers, ensuring reliable communication over vast distances.
Versatile Frequency Support: Supports multiple frequencies 850-930Mhz, including 868Mhz and 915Mhz, making it highly adaptable for global use in various applications.
High Power Output: With a power output of 22dBm, this module provides robust signal strength that penetrates through obstacles, enhancing connectivity in challenging environments.
Compact Design: The small form factor and surface-mount design make it easy to integrate into a wide range of devices, from industrial equipment to consumer electronics, without compromising performance.
Specification: Chip Model: SX1262, Module Dimensions: 20x14x2.3mm, Communication Protocol: LoRa Protocol, Transmit Power: 0~+22dBm, RF Interface: Stamp Hole/PEX, Hardware Interface: SPI, Modulation Method: LoRa and GFSK, Operating Voltage: 1.8V-3.7V.
The product printed words may vary depending the batch, but this does not affect use.
Color: As Shown
Material: PCB
Package Contents:
2* development boards
20* connecting wires (random colors)
2 *antennas
Details
| OPC | PX55JWP |
|---|---|
| Brand | ISTOVO |
| Codes | 6031447301331 (EAN) |
| Product and Safety Information |
Product Data
| Height | 2cm |
|---|---|
| Width | 12cm |
| Length | 21cm |
| Weight | 0.0695kg |
| Colour | As Shown |
| Material | PCB |
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