Paper Intelligence Embossed Craft Punch Sunflower Small

Paper Intelligence Embossed Craft Punch Sunflower Small Description

[Attention here] Embossing can be done at the same time as cutting. (It is now possible to emboss processing in addition to the die-cutting function of a normal craft punch.) To use it just insert the paper and push the lever. A paper-only punch that can be embossed at the same time as die cutting. It is a sophisticated design. With the principle of leverage it can be easily pulled out with a small force. For scrapbooking albums and card making. Paper suitable for punching is about 0.18 mm (120 g / m2) thick high-quality paper. Origami Japanese paper and thin paper may cause a paper jam (locked state). In that case stack 2 or 3 sheets and pull out or stack copy paper etc. and thicken and pull out. ? About scratches and damage on the package and product body The package may be scratched or damaged but since it is an imported product we cannot accept returns or exchanges for these reasons. ? About the sharpness of the punch Due to the structure of the craft punch thin paper such as copy paper cannot be cut out neatly. Use paper with some thickness and hardness such as card stock for scrapbooking (such as basil paper). In addition there are individual differences in sharpness and there may be products that cut cleanly and products that do not cut even with the above paper but it is not a punch that sells high precision and durability of die cutting. We may not be able to accept returns or exchanges for those reasons. Please note. * If you are looking for a highly accurate die we recommend a die-cut machine such as Revolution. Also long fiber paper such as Japanese paper and soft drawing paper may not be cut cleanly. DECOP (craft punch) is for paper only. If you remove the cloth felt plastic sheet etc. it may cause a malfunction. Also please refrain from using it as it may cause a lock if you remove the sticky material. Please note that it cannot be used for processing into foods such as seaweed.