Κέντρο βοήθειας | Τι είναι η Επιστροφή Ποσού;

Το Cashback Marketplace Άμεσα κέρδη σε όλα Δωρεάν παράδοση σε εκατομμύρια προϊόντα Υψηλή βαθμολογία Εξαιρετικές αξιολογήσεις στο Trustpilot Γίνε Cashback VIP Μεγαλύτερα ποσοστά, μεγαλύτερες προσφορές Επιστροφές 30 ημερών Και με προστασία αγορών

Λυπούμαστε, αυτό το προϊόν είναι προσωρινά εκτός αποθέματος.

LLM630 Compute Kit AI Large Language Model Inference Development Platform 3.2 TOPs AX630C SoC Processor 2.4 GHz Wi-Fi

Name: LLM630 Compute Kit AI Large Language Model Inference Development Platform 3.2 TOPs AX630C SoC Processor 2.4 GHz Wi-Fi
Brand: ISTOVO
SKU: PX5HNZ5
Price: 209.95 EUR
Availability: OutOfStock

Μάρκα ISTOVO

Νέο

209,95 €

Θα θέλατε να σας ενημερώσουμε πότε θα επιστρέψει;

Προσθήκη στο καλάθι

Περιγραφή & Λεπτομέρειες

Περίληψη

The LLM630 Compute Kit is an AI large language model inference development platform designed for edge computing and intelligent interaction applications. The mainboard also integrates an SMA antenna interface to further enhance wireless signal stability and transmission distance, ensuring stable communication in complex network environments.
The kit's mainboard is equipped with the Axera AX630C SoC processor, integrating a high-efficiency NPU with 3.2 TOPs @ INT8 computing power, providing powerful AI inference capabilities to efficiently execute complex vision (CV) and large language model (LLM) tasks, meeting the needs of various intelligent application scenarios.
The mainboard is also equipped with a JL2101-N040C gigabit Ethernet chip and an ESP32-C6 wireless communication chip, supporting Wi-Fi 6 @ 2.4 GHz, used as the device's network card, providing high-speed data transmission capabilities and achieving Wi-Fi and Ethernet bridging functionality.
It features built-in 4GB LPDDR4 memory (2GB for user use, 2GB dedicated to hardware acceleration) and 32GB eMMC storage, supporting parallel loading and inference of multiple models, ensuring efficient and smooth task processing.
The LLM630 Compute Kit is suitable for fields such as security monitoring, smart sales, smart agriculture, smart home control, interactive robots, and education, providing powerful computing capabilities and flexible expandability for edge intelligent applications.

LLM630 Compute Kit AI Large Language Model Inference Development Platform 3.2 TOPs AX630C SoC Processor 2.4 GHz Wi-Fi Περιγραφή

The LLM630 Compute Kit is an AI large language model inference development platform designed for computing and intelligent interaction applications. The mainboard also integrates an SMA antenna interface to further enhance wireless signal stability and transmission distance, ensuring stable communication in complex network environments.
The kit's mainboard is equipped with the Axera AX630C SoC processor, integrating a high-efficiency NPU with 3.2 TOPs @ INT8 computing power, providing powerful AI inference capabilities to efficiently execute complex vision (CV) and large language model (LLM) tasks, meeting the needs of various intelligent application scenarios.
The mainboard is also equipped with a JL2101-N040C gigabit Ethernet chip and an ESP32-C6 wireless communication chip, supporting Wi-Fi 6 @ 2.4 GHz, used as the device's network card, providing high-speed data transmission capabilities and achieving Wi-Fi and Ethernet bridging functionality.
It features built-in 4GB LPDDR4 memory (2GB for user use, 2GB dedicated to hardware acceleration) and 32GB eMMC storage, supporting parallel loading and inference of multiple models, ensuring efficient and smooth task processing.
The LLM630 Compute Kit is suitable for fields such as security monitoring, sales, agriculture, home control, interactive robots, and education, providing powerful computing capabilities and flexible expandability for intelligent applications.

It integrates a BMI270 6-axis sensor, providing precise attitude sensing and motion detection capabilities, suitable for various dynamic applications. The built-in NS4150B Class D amplifier and microphone and speaker interfaces support high-quality voice input and audio output, achieving full-duplex communication mode, enhancing user interaction experience. The baseboard also features 2 HY2.0-4P interfa

Λεπτομέρειες