High Temperature Resistant Silicone Pad For Phone Chip CPU

High Temperature Resistant Silicone Pad For Phone Chip CPU Description

Features:
High Temperature Resistant Silicone Pad for CPU Reballing Withstands up to 200C heat exposure while maintaining structural integrity, ensuring precise alignment for mobile chip repairs across multiple smartphone brands.
Engineered with a grooves to securely hold CPU chips during soldering operations, this silicone pad enhances accuracy in rework and reduces alignment errors for consistent repair results.
Ideal for professional mobile repair technicians, electronics workshop specialists, and multi brand service centers requiring tools for intensive soldering tasks.
Optimized for smartphone motherboard repairs, chip replacement projects, and on site servicing scenarios where heat resistant component and portability are critical for efficient workflow.
Crafted from wear resistant silicone, this repair tool meets occupational safety standards.

Specifications:
Component: Silicone
Size: about. 104x80x8mm/4.09x3.15x0.31in

Package Includes:
1pc Silicone Pad

note:
Please allow 1-2cm errors due to manual measurement.
Due to difference between different monitors, the picture may not reflect the item actual color.