Stamp-S3Bat DIP Embedded Core Module with Integrated Power Management ESP32-S3 M5StampS3 BAT Module with 2.54 Header Pin

Stamp-S3Bat DIP Embedded Core Module with Integrated Power Management ESP32-S3 M5StampS3 BAT Module with 2.54 Header Pin Description

Stamp-S3Bat DIP is an embedded core module with integrated power management. It features the ESP32-S3--1-N8R8 main controller, supporting 2.4GHz Wi-Fi with built-in 8MB Flash and 8MB PSRAM.
The module leads out 11 GPIOs and 1 wake- IO, equipped with a 24P BTB connector (supporting DVP interface). An onboard battery power interface is provided for connecting an external 3.7V lithium battery.
It integrates the M5MP1 multi-stage power control design, supporting power input/output control, lithium battery charging control, and status detection for input voltage and battery voltage.
It also supports external low-power wake-; after the main controller enters low-power sleep mode, the power can be woken via the external wake- IO.
Featuring a programmable RGB LED, the Stamp-S3Bat DIP version comes with pre-soldered 2.54mm standard pitch headers, allowing integration into applications via PCB insertion, breadboard connection, or Dupont cables to help developers quickly build IoT applications.

Features:
ntegrated ESP32-S3--1-N8R8 controller
8MB Flash and 8MB PSRAM
24P BTB connector (supporting DVP interface)
M5PM1 low-power power management
11 x GPIO leads + 1x Wake- IO
1x RGB LED
2.54mm standard pitch headers
Power Supply: 3.7V battery power supply (not included), USB Type-C / 5V
Applications: IoT project development

Specifications:
SoC: ESP32-S3--1-N8R8 @ Dual-core Xtensa LX7 processor, frequency to 240MHz
Flash: 8MB
PSRAM: 8MB
Wi-Fi: 2.4 GHz Wi-Fi
Input Power: 3.7V Battery / USB Type-C / 5V
RGB LED: 1 x WS2812
Battery Interface: SH1.0
Pad GPIO Leads: 11x GPIO (G1/G2/G3/G4/G5/G6/G7/G8/G9/G10/G11) + 1x Wake- IO (PY_G4_WAKE)
BTB Interface GPIO Leads: 19x GPIO (G40/G38/G12/G13/G14/G15/G16/G18/G21/G46/G45/G41/G43/G42