3X DX-LR30 SX1262 Chip Development SX1262 LoRa Module RF Module 8km 22dBm UART LoRa Spread Spectrum Technology 900M22SP

Descripción de 3X DX-LR30 SX1262 Chip Development SX1262 LoRa Module RF Module 8km 22dBm UART LoRa Spread Spectrum Technology 900M22SP

Efficient power dissipation of 0~22dBm, ensuring minimal usage while maintaining high performance.
Exceptional long-distance communication with a receiver sensitivity of -125dBm and a reference distance of to 8km in open visibility conditions.
Compatible with a range of supply voltages from 1.8 to 3.7 V, offering flexibility in power sources for various electronic projects and commercial products.
Compact module size of just 20x14 mm, engineered for easy integration into existing systems without compromising durability or functionality.
Chip Model: SX1262, Communication Protocol: LoRa Protocol, RF Interface: Stamp Hole/PEX, Hardware Interface: SPI, Operating Temperature: -40~+85C, Crystal Frequency: 32MHz, Transmit Current: 100mA, Modulation Method: LoRa and GFSK, RF Input Impedance: 50Ω, Antenna Interface: External Antenna, FIFO: 256 Bytes.

This module operates efficiently with a dissipation power of 0~22dBm, ensuring minimal usage while maintaining high performance. Achieve exceptional long-distance communication with a receiver sensitivity of -125dBm and a reference distance of to 8km in open visibility conditions. Compatible with a range of supply voltages from 1.8 to 3.7 V, this module offers flexibility in power sources, making it suitable for various electronic projects and commercial products. With a module size of just 20x14 mm, this compact unit is engineered for easy integration into existing systems without compromising durability or functionality.
Color: As Shown
Material: PCB
Specification: 900M22SP

Package Contents:
3 x LoRa Module