Precision Preheating Platform Kit for iPhone X-14 PM Motherboard & BGA Repair

Precision Preheating Platform Kit for iPhone X-14 PM Motherboard & BGA Repair Description

- Versatile and efficient reflow soldering heating platform designed for precise preheating and repair of iPhone motherboards from iPhone X to iPhone 14 Pro Max. - Compact and lightweight, weighing only 397 grams with dimensions of 160 x 130 x 33mm, suitable for both professional technicians and hobbyists. - Supports dual power inputs of 110V and 220V, making it adaptable for various regions and work environments. - Comes with a comprehensive set including a main unit, six modular heating plates, twelve steel meshes, a power cord, and an instruction manual. - Equipped with intelligent temperature control for accurate and stable heating, ensuring safe handling of delicate components. - Ideal for removing middle frames, touch screens, performing BGA reballing on layered chips, and other detailed repair tasks. - Compatible with a wide range of iPhone models including iPhone 12 mini, 12, 12 Pro, 12 Pro Max, 13 mini, 13, 13 Pro, 13 Pro Max, and 14 Pro Max. - Supports various repair applications such as desoldering, motherboard preheating, dot matrix repairs, and IC chip BGA stencil work. - Constructed from durable materials to ensure reliable performance during complex and precise repair processes. - Features an intelligent design that simplifies temperature management, providing a controlled and stable heating environment. - Suitable for professional repair shops and dedicated electronics enthusiasts seeking high-quality, precise motherboard and BGA repair solutions. Specifications: - Model: MECHANIC iT3 Pro - Power Supply: 110V / 220V (dual voltage support) - Weight: 397 grams - Dimensions: 160 x 130 x 33mm - Compatible Devices: iPhone X through iPhone 14 Pro Max - Included Accessories: host unit, six heating modules, twelve steel meshes, power cord, manual Features: - Precise temperature control for delicate electronic components - Modular heating plates for versatile repair tasks - Supports layered chip BGA reballing and dot matrix repairs - Compact and portable design for ease of use - Durable construction for long-term reliability - User-friendly interface for simplified operation