BGA Reballing Soldering PCB Heat Stencil 0.45mm

BGA Reballing Soldering PCB Heat Stencil 0.45mm Description

1、100% brand new and high quality. 2、These tin balls are used for connection of semiconductor chip, circuit module and PCB board. 3、They are quite small and can transmit electronic signal. 4、Each bottle contains about 25000 solder balls that will meet your basic need. 5、There are many different sizes you can choose, and you can choose 9 bottles to get them all.
Features:
100% brand new and high quality.
These tin balls are used for connection of semiconductor chip, circuit module and PCB board.
They are quite small and can transmit electronic signal.
Each bottle contains about 25000 solder balls that will meet your basic need.
There are many different sizes you can choose, and you can choose 9 bottles to get them all.
Specification:
Type(Optional)
Quantity
Size
Weight
#1
9 bottles
0.3
200g/7.1oz
#2
1 bottle
0.35mm
9g/0.3oz
#3
1 bottle
0.4mm
10g/0.4oz
#4
1 bottle
0.45mm
13g/0.5oz
#5
1 bottle
0.5mm
16g/0.6oz
#6
1 bottle
0.55mm
18g/0.6oz
#7
1 bottle
0.6mm
25g/0.9oz
#8
1 bottle
0.65mm
28g/1oz
#9
1 bottle
0.7mm
36g/1.3oz
#10
1 bottle
0.76mm
40g/1.4oz
Package list:
1 Set of Solder Balls(include 9 specifications)