BGA Reballing Stencil for Motherboard CPU IC Plant

BGA Reballing Stencil for Motherboard CPU IC Plant Description

[Planting Tin Steel Mesh ]BGA Reballing Stencil Design For Phone CPU IC Chip Repairm.BGA stencil is versatile and suitable for the common IC used in cell phones today, which can meet your various needs.

[BGA Reballing Stencil Material]The tin mesh solder template is made of premium stainless steel material, which is not easily damaged and good durability for long use.Crafted for durability, this stencil withstands high temperatures, ensuring reliable BGA reballing.
[Template Mesh Directly Heat]Template Mesh Directly Heat Multi-purpose BGA Reballing Stencils Make your repair work easier.these stencils are not easy to deform when heated.
[Precise Positioning]Tin mesh solder template is precisely positioned for fast tin implantation, and the ball template not change under high temperature.
Easy To Use]The stencil has a compact appearance and is easy to carry around and use.The BGA Rework Net is easy and quickly for reballing the BGA IC, useful and economical accessories for BGA soldering.
Color: As Shown
Material: Metal

Package Contents:
1*Heated steel mesh

Only the above package content, other products are not included.
Note: Light reflection and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.