BGA Reballing Stencil Set Steel Rounded Rectangle for Samsung CPU

BGA Reballing Stencil Set Steel Rounded Rectangle for Samsung CPU Description

1、FAST AND ACCURATE: The speed of tin planting is fast, the ball template will not change under high temperature, and bring accurate positioning 2、COMPACT AND PORTABLE: BGA reballing stencil come with compact appearance, portable, easy to use and long lasting 3、NO TIN STICKING OR BROKEN CORNERS: Using half cut process, there are many IC groove on the main body of the stencil, which can effectively prevent small ICs from sticking to tin and protect small ICs from breaking corners 4、APPLICABLE MODELS: Suitable for Samsung S7 series, NOTE8 series, A5 series, NOTE4 series, JS series and other models 5、13PCS IN TOTAL: The package contain a total of 13pcs steel stencil, enough for you to replace and use, very convenient
Item Type: BGA Reballing Stencil
Compatible Product Model:
For Samsung S8, S8+, NOTE8 series G9500, G955U, N9500
For Samsung S7 series G9300, 9350, 9308, G930F
For Samsung S6, S6+, NOTE5 G9200, 9250, N9200
For Samsung A520, A310, S5mini Universal A7, A5, A3, S5, JS series
For Samsung C7010, J610 Universal C7, J3, J5, A5 series
For Samsung S9, S9+
For Samsung NOTE4 series
For Samsung J1, J2, J3, 4, J100H, J320F, G570M
For Samsung S10, S10+, NOTE10, G9730, G975, G977, N975
For Samsung S20 G988U, G988B, BR
For Samsung A60-A90, A10S, A605F, A705F, A920F
For Samsung A10-A70A105F, A202F, A305N, A40S, A505F, A515F, A530F, N600F, A750F
For Samsung S21, 21+, 21ULTRA, G998U, G996U, Z FLIP3, Z FOLD3, W22
13 x Tin Planting Net
1 x Storage Book