CPU Thermal Pads, High Temperature Resistance, Malleability, Soft Cooling Thermal Pad For Memory Chipset

CPU Thermal Pads, High Temperature Resistance, Malleability, Soft Cooling Thermal Pad For Memory Chipset Description

100mm x 100mm x 3mm CPU Chip Heatsink Cooling Thermal Conductive Silicone Pad Specification: Description: You can cut the pad into different size according to your needs. Free installation,maximum heat conduction and increased cooling. Great for graphic cards,graphic chips,North-south bridge chip, memory chipset, IC. Features: 1. Excellent temperature resistance high and low, superior thermal conductivity.2. Soft texture, low viscosity.3. Ideal for CPU chip or LED heat dissipation.4. Effective heat conduction, exceptional malleability. 5. Can be cut to any desired size. Specifications: Condition: New Material: silicon Gel Color: Blue Size: Approx. 100 x 100 x 3 mm / 3.9 x 3.9 x 0.1 in Thermal Conductivity: 5.0 Density: 2.35 Hardness: 13c - 50c Permittivity: 26018 Temperature: -40C - 220C Voltage Resistance: > 4kv Fire Resistance: UL94 V0 Tensile Strength:PSI Greater than or equal to 35 Package Included: 1 x CPU Thermal Pad Notes: 1.Please allow 1-3 cm error due to manual measurement. Thanks for your understanding. 2.Monitors are not calibrated same, item color displayed in photos may be showing slightly different from the real object. Please take the real one as standard. High temperature resistance, low temperature, superior thermal conductivity Soft, low viscosity Ideal for CPU chip or LED heat dissipation Effective heat conduction, exceptional malleability.