Mijing High Purity Tin Paste, Model:183

Mijing High Purity Tin Paste, Model:183 Description

The Mijing High Purity Tin Paste Model 183 is a professional-grade solder paste designed for mobile phone motherboard repair and BGA chip rework. With a standard melting point of 183 degrees Celsius, this paste is the go-to choice for traditional lead-free soldering applications and is widely used across the phone repair industry.

Made with a high-purity formula, this solder paste provides superior wettability and smooth flow characteristics that promote strong, reliable solder joints. The advanced formulation minimises the occurrence of false soldering and bridging, making it ideal for precision work on densely populated circuit boards and fine-pitch BGA components.

Each 50g tub features a practical square mouth opening for easy and controlled dispensing. The design allows you to scrape excess paste back into the container, reducing waste and keeping your workspace clean. The secure screw-top lid preserves freshness between uses.

This versatile paste is compatible with hot air rework stations, preheaters, and reflow ovens, making it suitable for a broad range of electronic repair and assembly tasks including smartphone motherboard repair, tablet servicing, and general PCB rework.

Package Contents:

• 1 x Mijing High Purity Tin Paste Model 183 (50g)