Pack of 3 D2PAK3 Package

Pack of 3 D2PAK3 Package Description

The STMicroelectronics STGB30V60DF is a dual Schottky barrier rectifier in a D2PAK3 surfacemount package. Designed for efficiency power conversion, it combines two Schottky diodes in a single compact package, with a side heat slug to aid thermal performance. The device is supplied as a set of three pieces. Key benefits efficiency: low forward voltage drop inherent to Schottky rectifiers helps maximize converter efficiency and reduce system heat. Compact, robust packaging: D2PAK3 package delivers a reliable, surfacemount solution with good thermal dissipation in a small footprint. Reduced BOM and board space: dual diode in one package lowers part count and simplifies PCB layout. Easy SMT integration: designed for standard surfacemount assembly and reflow processes, enabling straightforward implementation in production runs. Reliable for lowvoltage, current applications: suitable for demanding rectification duties in power electronics. Key attributes Functionality: dual Schottky barrier rectifier VRRM (maximum reverse voltage): 30 V I(AV) (average forward rectified current): 60 A Package: D2PAK3, surfacemount with a side heat slug for enhanced cooling Configuration: dual rectifier in a single package Material: silicon Schottky diodes Package features: supports standard SMT assembly with good thermal performance Applications and use cases Input rectification and output rectification in DCDC converters and switching power supplies Freewheeling/decoupling diodes in buck and boost converter stages for motor drives and power electronics Lowvoltage, current rectification in consumer electronics, automotiveinspired designs, and other compact powerregulation circuits Package and quantity Three pieces per D2PAK3 package suitable for surfacemount assembly and hotswap tolerant applications In short, the STGB30V60DF in D2PAK3 provides a compact, efficient dual Schottky rectifier option with a 30 V rating and 60 A current capability, packaged for easy SMT integration and reliable thermal performance.