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Summary
Phone CPU BGA Reballing Stencil Reball Rework Template Screen for IPhone 11 Pro Max
1、Quick in Tinning: Fast in tinning speed and accurate in positioning, the BGA reballing stencil is not likely to deform under high temperature. 2、Safe for IC Chip: The IC slots on the main body can effectively prevent small IC tin from sticking and prevent small IC from breaking corners. 3、Perfect Fitting: Allows for wide application on for A13 CPU as well as for For iPhone 11, for iPhone 11 Pro, for iPhone 11 Pro Max, very useful. 4、Stainless Steel: The premium stainless steel material with standard design has a sturdy structure, which is very durable for long term using. 5、Simple Carrying: Compact in size and light in weight, the phone CPU rework stencil is very convenient to carry, and very simple to work on it.
Item Type: Phone CPU BGA Reballing Stencil Product Material: Stainless Steel Spacing: 0.12mm Applicable CPU: For A13 Applicable Product Models: For iPhone 11, for iPhone 11 Pro, for iPhone 11 Pro Max.
1 x Phone CPU BGA Reballing Stencil
Details
| OPC | PJMNYQN |
|---|---|
| Codes | 9121376706738 (EAN) |
Product Data
Dimensions
| Height | 1.0cm |
|---|---|
| Width | 10.0cm |
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