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Phone CPU BGA Reballing Stencil Reball Rework

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£9.40

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Description & Details

Summary

  • 1、Quick in Tinning: Fast in tinning speed and accurate in positioning, the BGA reballing stencil is not likely to deform under high temperature.
  • 2、Safe for IC Chip: The IC slots on the main body can effectively prevent small IC tin from sticking and prevent small IC from breaking corners.
  • 3、Perfect Fitting: Allows for wide application on for A13 CPU as well as for For iPhone 11, for iPhone 11 Pro, for iPhone 11 Pro Max, very useful.

Phone CPU BGA Reballing Stencil Reball Rework Description

Phone CPU BGA Reballing Stencil Reball Rework Template Screen for IPhone 11 Pro Max



1、Quick in Tinning: Fast in tinning speed and accurate in positioning, the BGA reballing stencil is not likely to deform under high temperature. 2、Safe for IC Chip: The IC slots on the main body can effectively prevent small IC tin from sticking and prevent small IC from breaking corners. 3、Perfect Fitting: Allows for wide application on for A13 CPU as well as for For iPhone 11, for iPhone 11 Pro, for iPhone 11 Pro Max, very useful. 4、Stainless Steel: The premium stainless steel material with standard design has a sturdy structure, which is very durable for long term using. 5、Simple Carrying: Compact in size and light in weight, the phone CPU rework stencil is very convenient to carry, and very simple to work on it.



Item Type: Phone CPU BGA Reballing Stencil Product Material: Stainless Steel Spacing: 0.12mm Applicable CPU: For A13 Applicable Product Models: For iPhone 11, for iPhone 11 Pro, for iPhone 11 Pro Max.



1 x Phone CPU BGA Reballing Stencil

Details

OPC PJMNYQN
Codes 9121376706738 (EAN)

Product Images

Phone CPU BGA Reballing Stencil Reball Rework 1
Phone CPU BGA Reballing Stencil Reball Rework 2
Phone CPU BGA Reballing Stencil Reball Rework

Product Data

Dimensions

Height1.0cm
Width10.0cm

Sorry, this item is temporarily out of stock.

Phone CPU BGA Reballing Stencil Reball Rework

New
£9.40

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