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Phone CPU BGA Reballing Stencil Reball Rework
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£10.53
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Description & Details
Summary
- 1、Quick in Tinning: Fast in tinning speed and accurate in positioning, the BGA reballing stencil is not likley to deform under high temperature.
- 2、Safe for IC Chip: The IC slots on the main body can effectively prevent small IC tin from sticking and prevent small IC from breaking corners.
- 3、Perfect Fitting: Allows for wide application on for A520, A310, S5mini series, and the remplate is also universal for A7, A5, A3, S5, J7 series.
Phone CPU BGA Reballing Stencil Reball Rework Description
Phone CPU BGA Reballing Stencil Reball Rework Template Screen for Samsung A520 A310 S5mini
1、Quick in Tinning: Fast in tinning speed and accurate in positioning, the BGA reballing stencil is not likley to deform under high temperature. 2、Safe for IC Chip: The IC slots on the main body can effectively prevent small IC tin from sticking and prevent small IC from breaking corners. 3、Perfect Fitting: Allows for wide application on for A520, A310, S5mini series, and the remplate is also universal for A7, A5, A3, S5, J7 series. 4、Stainless Steel: The premium stainless steel material with standard design has a sturdy structure, which is very durable for long term using. 5、Simple Carrying: Compact in size and light in weight as well, the phone CPU rework stencil is very convenient to carry, and simple to work on.
Item Type: Phone CPU BGA Reballing Stencil Product Material: Stainless Steel Spacing: 0.12mm Applicable Product Model: For A520, A310, S5mini series, universal for A7, A5, A3, S5, J7 series.
1 x Phone CPU BGA Reballing Stencil
Details
| OPC | PJMNZKX |
|---|---|
| Codes | 9121376707285 (EAN) |
Product Data
Dimensions
| Height | 1.0cm |
|---|---|
| Width | 8.0cm |
Would you like us to let you know when it's back?
Phone CPU BGA Reballing Stencil Reball Rework
New
£10.53
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