Tin Solder Paste Sn96.5 Ag3 Cu0.5 High Temp Strong Adhesion

Tin Solder Paste Sn96.5 Ag3 Cu0.5 High Temp Strong Adhesion Description

1、217 High Melting Point: Environmental protection high temperature solder paste, Alloy Sn96.5/Ag3/Cu0.5, 217 degrees Celsius high melting point. 2、Scope of Application: Solder Paste has extremely strong continuous printing performance, suitable for fine pitch ICC and BGA and more precise components soldering, circuit boards, IC, telephone, TV and other household appliances and industrial equipment. 3、Strong Adhesion: Soldering flux paste strong adhesion, bright solder joints, bright residue less, good conductivity, paste fine. 4、Strong Dry Resistance: Tin paste has good wettability and demoldability, and is resistant to cold collapse, hot collapse, and strong resistance to dryness. 5、Lightweight and Portable: 45g package, compact, easy to carry and store, even if you go out, you can also easily carry and use.
Item Type: Tin Solder Paste
Material: Tin Paste
Weight: Approx. 45g / 4.6oz (Range Deviation: 1-2g)
Alloy: Sn96.5/Ag3/Cu0.5
Particle: 20-38μm
1 x
Tin Solder Paste