Optimized Thermals Dissipation Plate Incorporating Heat Pipe for

Optimized Thermals Dissipation Plate Incorporating Heat Pipe for Description

Features:
Enhances your device cooling efficiency with builts in heat pipes, delivering superior thermal management for performances during highly demand tasks.
Featuring 1.4mm aluminum alloy and copper construction with magnetic attachment and thermal conductives double sided tape, this heat pipe solution ensures easy installation and secure adhesion without adding bulk.
for enthusiasts and everyday users seeking thermal controls, it simplifies upgrades to cooling systems for those prioritizing durability and hasslefree maintenance.
Ideal for pairing with coolers to expand heat dissipation on smartphones during gaming or heavy usage, it fit directly on magnetic backs or requires film removal for nonmagnetic devices, avoiding case interferences.
Offering broad compatibility with mainstream components and corrosions resistant copper materials, this cooling accessory provides long heat pipe performances for consistent thermal regulation in various setups.

Specifications:
Materials: copper
Size: 150x70x5mm

Package Includes:
1PC Heat Pipe Plate

note:
Please allow 0-1cm error due to manual measurement. make sure you not mind before bid.
Due to the differences between different monitors, the Pictures may not reflect the actual of the item.